Authors: Y. P. Zhang
Source: FERMAT, Volume 14, Communications 6, Mar Apr., 2016
Abstract: The antenna-in-package (AiP ) technology combines an antenna (or antennas) with a single-chip radio die into a standard surface mounted device symbolizing an innovative and important development in the miniaturization of wireless communications systems in recent years. The AiP technology is now the mainstream antenna technology and has been widely adopted by chip makers for 60 GHz radios. The slides focus on the development of the AiP technology in low-temperature cofired ceramic (LTCC) process for 60 GHz radios by Y. P. Zhang and his students and collaborators
Keywords: Antenna: Discrete antenna, integrated antenna, and AiP; Package: Wire-bond package, flip-chip package; Circuit: Discrete circuit, integrated circuit; Chip: Packaged die, bare die; Process: LTCC, PCB, and CMOS
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Antenna-in-Package (AiP) Technology